Our technology roadmap is both for our use and for yours, our customer. It helps us in our annual planning to determine directions we need to move technologically and for you to see what we are striving toward. We are committed to continually improving our capabilities and always welcome suggestions or recommendations regarding future technologies.

Manufacturing Capabilities	2004	2005	2006	2007	2008
Drilling aspect ratio	8:1	10:1	11:1	12:1	12:1
Minimum drill size (thru hole)	0.005	0.005	0.005	0.005	0.005
Minimum finished hole size (thru hole)	0.004	0.004	0.004	0.004	0.004
Minimum annular ring (pad/drill)	0.003	0.002	0.002	0.002	0.002
Minimum annular ring clearance (anti pad)	0.006	0.006	0.006	0.006	0.006
Standard annular ring clearance (anti pad)	0.01	0.01	0.01	0.01	0.01
Minimum drill to copper feature clearance	0.006	0.006	0.006	0.006	0.006
Minimum Blind/Buried via pad size	0.015	0.014	0.014	0.014	0.014
Minimum Blind/Buried via hole size	0.005	0.005	0.005	0.005	0.005
Minimum Micro-via pad size	-	0.010 -.008	0.010 -.008	0.010 -.008	0.010 -.008
Minimum Micro-via hole size	-	0.004 -.002	0.004 -.002	0.004 -.002	0.004 -.002
Minimum line width	0.003	0.003	0.003	0.002	0.002
Minimum spacing	0.003	0.003	0.003	0.002	0.002
Maximum overall board thickness	0.250	0.250	0.250	0.250	0.250
Minimum dielectric thickness	0.0018	0.0014	0.0014	0.0014	0.0014
Minimum component pitch	0.008	0.008	0.008	0.008	0.008
Layer to layer registration tolerance +/-	0.003	0.003	0.003	0.003	0.003
Conductor to board edge	0.005	0.005	0.005	0.005	0.005
Solder mask clearance	0.002	0.002	0.002	0.002	0.002
Minimum base copper weight	1/4 oz	1/8 oz	1/8 oz	1/8 oz	1/8 oz
Average layer count	8	10	10	12	14
Tolerance - plated holes	+/-0.002	+/-0.002	+/-0.002	+/-0.002	+/-0.002
Maximum PCB dimensions	21 x 23	21 x 23	21 x 23	21 x 23	21 x 23
Impedance tolerance	+/-10%	+/-7%	+/-7%	+/-7%	+/-7%
Heat Sink Bonding	x	x	x	x	x
Bonded dielectric Insulators	x	x	x	x	x
"Plated edges, countersinks & counterbores"	x	x	x	x	x

Surface Finishes Available: HASL, Soft and Hard Gold, Nickel, Fused Tin/Lead, OSP

New surface finishes	2004	2005	2006	2007	2008
	-	-	Immersion Silver & Gold	TBD	TBD

Dielectric Materials Available:	2004	2005	2006	2007	2008
Multi-functional FR4 tg 140	X	X	X	X	X
RHOS compliant Hi-Temp FR4 tg 170		X	X	X	X
Polyimide	X	X	X	X	X
Getek	X	X	X	X	X
Rogers 4003 & 4350	X	X	X	X	X